SECS/GEM, the Semiconductor Equipment Communication Standard/Generic Equipment Model, is a communication protocol widely used in the semiconductor manufacturing industry. It defines the communication method between semiconductor equipment and factory host systems (such as MES), enabling equipment to automatically report status, execute commands, and exchange data.

Hegong Software''s RockPlus SECS/GEM platform provides SECS/GEM protocol data forwarding services for semiconductor, photovoltaic (PV), and electronics industries, enabling equipment to communicate with EAP. It serves as a communication bridge, connecting equipment software or hardware on one end and EAP systems via SECS/GEM protocol on the other, opening up SECS/GEM communication interfaces. For common semiconductor equipment including crystal pullers, VPE furnaces, MBE systems, oxidation furnaces, LPCVD, PECVD, magnetron sputtering, CMP, lithography machines, RIE, ICP etchers, wet etching and cleaning, ion implanters, wafer thinning, dicing saws, and wire bonders, the SECS/GEM platform provides pre-configured connection commands for immediate use without coding, significantly saving integration time.

RockPlus SECS/GEM Platform is designed for:

(1) Semiconductor fabs implementing production line automation or retrofitting legacy equipment: The platform provides a simple method to integrate and upgrade production lines to support SECS/GEM communication interfaces.

(2) Semiconductor equipment suppliers requiring SECS/GEM protocol interfaces: Suppliers can use the platform to rapidly develop and implement SECS/GEM-compatible communication interfaces, expanding their product market adaptability.

(3) EAP or MES implementers without SECS/GEM interfaces: The platform provides an efficient way to extend system functionality for seamless integration with SECS/GEM-compliant equipment.

Key Advantages:

(1) Broad Protocol Support: Supports SEMI E5 (SECS-II), E30 (GEM), E37 (HSMS) and more, ensuring compatibility with various semiconductor equipment.

(2) Multi-Interface Data Integration: Supports OPC DA, OPC UA, Web Service, API, and RESTful interfaces, enabling easy integration with diverse data sources for MES and enterprise applications.

(3) Multi-Device Data Integration and Forwarding: Handles data from multiple devices for integrated forwarding, crucial for unified data management and analysis in large-scale production.

(4) Multiple SECS/GEM Connections: Supports multiple simultaneous connections, making communication with multiple devices and systems possible, enhancing flexibility and scalability.

RockPlus SECS/GEM Platform provides semiconductor manufacturing with an efficient, flexible, and highly compatible equipment connectivity solution, helping enterprises improve production efficiency, reduce costs, and maintain rapid responsiveness to market changes.