Case Center

Built on RockPlus EAM and RFID technology, the system delivers automatic Tooling identification, changeover verification and equipment-start interlocking for Plasma equipment — upgrading manual error-checking to equipment-level forced error-proofing. Qualcomm RF Technology (Wuxi) Co., Ltd. is an enterprise focused on the R&D, production and manufacturing of high-performance RF (radio frequency) technology, with a production floor involving a wide range of high-precision manufacturing equipment and complex process flows. In the customer's JigSaw-related production lines and project scenarios, Plasma equipment must change the corresponding Tooling fixtures according to different product models and production programs. As product models and production changeovers become more frequent, the traditional reliance on operators to manually identify and verify Tooling creates risks of mis-installation, missed installation and model mismatch. To address this, Hegong Software built an RFID Tooling error-proofing system for the Plasma equipment on the basis of the RockPlus EAM (Enterprise Asset Management) platform , combining automatic RFID identification, high-temperature and anti-metal RFID tags, industrial control boxes and equipment signal interlocking — upgrading the process from "manually confirming Tooling" to "automatic RFID identification + systematic automatic verification + enforced error-proofing on the Plasma equipment". Project Overview Plasma is a key process equipment in this production environment. When switching products, the equipment must simultaneously replace several Tooling fixtures inside it; different products, programs and mounting positions correspond to different Tooling. Previously, changeovers relied mainly on operators preparing Tooling according to the current product model and completing installation and confirmation manually. Because some fixtures look very similar, relying only on personnel experience and checklists cannot mechanistically eliminate picking the wrong fixture, installing it in the wrong position, or model mismatch. This project deployed the RFID Tooling identification and error-proofing system across 5 Plasma machines on site. The system establishes a unique RFID identity for each Tooling fixture; RFID antennas inside the equipment automatically read the currently installed Tooling, and RockPlus EAM automatically compares each reading against the current product, equipment program and fixture mounting position. The project also upgraded the control circuit of the Plasma equipment : an industrial control box was wired into the equipment start/stop control signal, directly interlocking the RFID verification result with the equipment start condition. The Plasma equipment is allowed to start only after the Tooling at every specified position has been identified and verified correct. If any Tooling is not detected, mismatches the model, or is installed in the wrong position, the system locks the equipment start signal and production cannot proceed. This forms the forced error-proofing closed loop: Select product/program → RFID automatically identifies Tooling → position-by-position system verification → alarm and Plasma equipment lock on any mismatch → all matched → equipment lock released → Plasma equipment starts production

Connecting production equipment, manufacturing processes, and laboratory quality data to support scaled domestic production of critical semiconductor materials Chemical Mechanical Planarization (CMP) is a key process step in semiconductor manufacturing. As an essential consumable in that process, the material performance, machining precision, and batch consistency of CMP polishing pads directly affect downstream wafer fabrication. Unlike conventional manufactured products, CMP polishing pads carry the dual attributes of a semiconductor material and an advanced-materials manufacturing product . From raw materials, pre-mixing, casting, and curing, through slicing, sanding, engraving, cleaning, and lamination to final inspection, the manufacturing process involves large volumes of material parameters, equipment parameters, process parameters, and laboratory test data, placing high demands on product consistency, process stability, and full-process traceability. At the same time, as China's semiconductor supply chain continues to advance self-reliance, critical semiconductor materials including CMP polishing pads are accelerating domestic substitution. The focus of industry competition is shifting from "can the product be developed" to "can it be manufactured stably, with continuously improving consistency and scaled delivery." Against this backdrop, a leading domestic CMP manufacturer partnered with Hegong Software to build, on the RockPlus MOM Manufacturing Operations Management Platform , primarily the RockPlus MES Manufacturing Execution System and the RockPlus LIMS Laboratory Information Management System , connecting shop-floor production, equipment, processes, quality, and laboratory data into an integrated manufacturing and quality management platform covering the entire CMP polishing pad production process. Confidentiality notice: CMP polishing pads are among today's critical "choke-point" semiconductor materials targeted for domestic breakthrough. The project involves the customer's production processes, equipment parameters, and quality data, and carries high technical and commercial confidentiality requirements. This case study therefore does not disclose the customer's full corporate name and consistently refers to it as "a leading domestic CMP manufacturer."

SJ Semiconductor Co., Ltd. is an integrated circuit wafer-level advanced packaging and test enterprise, whose business covers 12-inch middle-end wafer processing, wafer-level packaging (WLP), and chiplet multi-die integrated packaging. As production scale continues to expand, the shop floor has evolved into a multi-vendor automated manufacturing system comprising printers, SPI, die bonders, AOI, reflow ovens, dispensing equipment, and more. To achieve unified connectivity of heterogeneous equipment, automated process control, and data interconnect, Hegong Software built the equipment automation solution for SJ Semiconductor on RockPlus GEMLink . Through standard protocols such as SECS/GEM and HSMS, it interconnects the MES/Host, the EAP/EFEM equipment automation software, and the production equipment. The automation capability now covers more than 20 production lines, providing a unified software platform for future equipment expansion and rapid line replication.

JCET Group, founded in 1972, is a leading global integrated circuit manufacturing and technology services enterprise with six manufacturing bases and two R&D centers in China, South Korea, and Singapore. Provides comprehensive one-stop chip finished-product manufacturing services.