RockPlus GEMLink SECS/GEM Equipment Integration Platform - Semiconductor Equipment Communication Solution

RockPlus GEMLink

SECS/GEM Equipment Integration Platform

Unified equipment communication: turn one-off device integration into a reusable capability

RockPlus GEMLink is an equipment communication and automation foundation platform built by Hegong Software for the semiconductor, electronics and photovoltaic industries. Through standardized SECS/GEM communication it connects production equipment with EAP / MES / Host systems, uniformly handling key interactions such as equipment status, events, alarms, remote commands, recipes and communication logs, reducing the complexity of integrating multi-brand equipment and scaling over time.

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Equipment Integration Architecture

MES / Host

EAP

RMS / CIM

RockPlus GEMLink SECS/GEM communication & equipment connectivity foundation

Semiconductor Equipment

Electronics / SMT Equipment

Photovoltaic Equipment

A unified communication foundation upward; equipment brand, interface and data-model differences shielded downward.

80units

Production equipment successfully connected in the customer case

20+lines

Production lines running on the unified framework

3standards

Core SEMI E5 / E30 / E37 standards supported

1platform

Uniformly connecting equipment with EAP / MES / Host

BUSINESS CHALLENGES

Equipment integration is more than just reading data out

What really limits production line automation is the long-term complexity of multi-brand equipment integration, business closed loops and replicating to new lines.

Divergent Equipment Interfaces

Vendors differ in communication methods, data variables, event definitions and control capabilities, forcing upper-layer systems to adapt repeatedly.

Hard to Replicate Integration

When new equipment or new production lines are added, developing each device from scratch keeps increasing project cycles and maintenance costs.

Automation Closed Loops

Production requires more than data collection: complete business interactions such as Event, Alarm, Remote Command and Recipe must be closed-loop.

High On-Site Integration Cost

Real-equipment testing windows are limited; resolving interface issues on site lengthens go-live schedules and raises implementation risk.

Unified Equipment Communication Layer

Converging multi-brand equipment differences into one standard platform

RockPlus GEMLink sits between production equipment and EAP / MES / Host systems. Downward it standardizes the communication interfaces, data variables, events and control capabilities of different equipment; upward it provides a unified communication foundation, so business systems no longer need to adapt to every device individually.

Core goals: unified connection, unified messaging, unified events and unified control — building a reusable foundation for equipment automation and new production line replication.

Upper-layer business systems

MES

EAP

RMS

Host / CIM

RockPlus GEMLink

Connection

Status

Event

Alarm

Remote Cmd

Recipe

Report

Log

Equipment layer

Printer / Mounter

SPI / AOI

Oven / Dispenser

Wafer / Loader

CORE CAPABILITIES

Core Capabilities

Standardized SECS/GEM communication around equipment connectivity, data exchange and production control.

01 / CONNECTION

Communication & Status Management

Manages HSMS communication connections, Equipment Online / Offline states and Host Communication State.

02 / STATUS

Equipment Status & Data Query

Uniformly obtains Equipment Status, state variables and related production process data, providing the data foundation for upper-layer automation applications.

03 / EVENT

Event Report

Receives and reports equipment events, linking key production actions and status changes with Host / EAP business workflows.

04 / ALARM

Alarm Management

Handles equipment Alarm information uniformly so exceptions are sensed, recorded and traceable in real time by upper-layer systems.

05 / COMMAND

Remote Command

Sends remote commands to equipment through standard communication interfaces, handling execution results and status feedback.

06 / RECIPE

Recipe Management

Supports PPID query and recipe upload / download / query for automatic program selection and process control.

07 / REPORT

Report Definition

Defines Reports around equipment data and events, establishing consistent and maintainable data reporting across different devices.

08 / DIAGNOSIS

Communication Log & Exception Handling

Keeps SECS/GEM communication logs and exception information for easier joint debugging, fault localization and maintenance.

TARGET USERS

Target Users

Three typical profiles — factories, equipment vendors and system integrators — each with different equipment integration value.

Semiconductor Manufacturers

For line automation, new equipment integration and networking retrofits of legacy equipment.

Unified connection to EAP / MES / Host
Lower multi-brand equipment adaptation complexity
Supporting data collection and remote automatic control

Semiconductor Equipment Vendors

Helping equipment software quickly build standard SECS/GEM communication capability.

Less repetitive low-level communication development
Faster adaptation to customer factory systems
Better equipment automation integration capability

EAP / MES Integrators

Extending a standardized equipment communication entry for upper-layer systems.

Unified communication across multi-vendor equipment
Shielding equipment brand and interface differences
Lower project delivery and maintenance cost

DEPLOYMENT

From equipment interface to production line

A standardized implementation path that turns one-off equipment integration into replicable connectivity capability.

Equipment Interface Review

Clarify communication protocols, variables, events, alarms, recipes, remote control and other equipment capabilities.

Communication Mapping & Configuration

Map equipment capabilities to standardized SECS/GEM messages, data and interaction logic.

Interface Integration Testing

Verify message, event, control and exception scenarios between Host / EAP and equipment.

Go-Live & Continuous Replication

Apply verified capabilities to similar equipment, new machines and future production lines.

Protocols & Interfaces

Compliant with core semiconductor equipment communication standards

RockPlus GEMLink supports SEMI E5 (SECS-II), E30 (GEM) and E37 (HSMS), and can connect equipment software, hardware and enterprise applications through multiple data interfaces.

SEMI E5 / SECS-II SEMI E30 / GEM SEMI E37 / HSMS OPC DA OPC UA Web Service API RESTful

Note: this page only lists protocols and interfaces currently confirmed for public release; additional standards will be added after product confirmation.

Standard / Interface	Type	Main Purpose
SEMI E37	HSMS	TCP/IP-based equipment communication connections
SEMI E5	SECS-II	Equipment messages, data structures and Stream / Function interaction
SEMI E30	GEM	Equipment behavior model for status, events, alarms and remote control
OPC DA / OPC UA	Industrial interfaces	Connecting equipment software, control systems or data sources
Web Service / API / RESTful	Application interfaces	Data integration with EAP, MES and enterprise applications

CUSTOMER CASE

Advanced Packaging Equipment Integration

Unified equipment communication built on RockPlus GEMLink, then replicated across multiple production lines.

Customer Case · Semiconductor Advanced Packaging

From equipment communication to production line automation coordination

A unified EAP / EFEM software layer was built between MES / Host and production equipment, achieving communication, data collection, remote control and business coordination across recipe, FOUP, SlotMap, Wafer and Alarm via SECS-II, GEM and HSMS.

80production equipment successfully connected

20+production lines on a unified framework

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Case Value

The product page only distills the results that best prove GEMLink's delivery capability; details remain on the case page.

Unified Communication StandardMulti-brand equipment brought into one SECS/GEM communication system.

Equipment Remote ControlRemote Command coordinated with automated business workflows.

Real-Time Event & AlarmEvents, alarms and status changes synchronized to upper-layer systems.

Automatic Recipe ManagementCovering query, upload / download, automatic selection and parameter verification.

Wafer-Level Data CorrelationLinking FOUP, SlotMap, Wafer, recipe and process information.

Fast New-Line ReplicationReusing the unified platform, equipment drivers and verified business logic.

APPLICATION

Typical Equipment Integration Scenarios

Covering diverse automation equipment in semiconductor manufacturing, advanced packaging, electronics assembly and photovoltaics.

SEMICONDUCTOR

Wafer Fabrication Equipment

CVD, PVD, etch, CMP, cleaning, ion implantation, thinning, dicing and other equipment.

OSAT

Packaging & Test Equipment

Wafer Loader, Wire Bonder, Dispenser, inspection and related packaging equipment.

SMT

Electronics Assembly Equipment

Printer, SPI, Mounter, AOI, Reflow Oven and other production equipment.

PV & AUTOMATION

Photovoltaic & Automation Equipment

PV production equipment, Loader / UnLoader, Conveyor and other automation equipment.

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